GPU ROADMAP 2026–2028
Release timeline for next-generation data center GPUs from NVIDIA, AMD, Google, and Intel. Updated as new information becomes available.
2026
8 GPUsNVIDIA B300 Ultra
NVIDIAAvailableProcess
TSMC 4NP
Memory
288GB HBM3e
FP8 TFLOPS
7,000
TDP
1,400W
Key Feature
2× H100 per GPU, 10 TB/s memory bandwidth
Blackwell Ultra generation. Shipping in limited quantity to hyperscalers and cloud providers.
AMD Instinct MI350X
AMDAvailableProcess
TSMC 3nm
Memory
288GB HBM3e
FP8 TFLOPS
4,600
TDP
1,000W
Key Feature
CDNA4 architecture, 8 TB/s memory bandwidth
AMD's CDNA4 generation. Competitive with B200 on VRAM; still ramps to availability.
NVIDIA B300A
NVIDIAAnnouncedProcess
TSMC 4NP
Memory
288GB HBM3e (unified CPU+GPU)
FP8 TFLOPS
TBD
TDP
~1,200W
Key Feature
ARM Neoverse CPU + Blackwell GPU die — full unified memory
Grace Blackwell Ultra variant. Targeting workloads that benefit from unified CPU-GPU memory addressing.
Google TPU v7
GOOGLEAvailableProcess
Custom ASIC
Memory
TBD
FP8 TFLOPS
~4,000 (est.)
TDP
~600W
Key Feature
2× TPU v5p performance, JAX-native, pods to 8,192 chips
Available on Google Cloud. Best for JAX-native workloads and Google-style distributed training.
AMD Instinct MI355X
AMDAvailableProcess
TSMC 3nm
Memory
288GB HBM3e
FP8 TFLOPS
4,610
TDP
1,400W
Key Feature
Highest VRAM of any commercially available GPU
Premium CDNA4 variant. Maximum VRAM configuration for very large model training.
AMD Instinct MI400X
AMDAnnouncedProcess
TSMC 3nm+
Memory
384GB+ HBM4 (est.)
FP8 TFLOPS
~8,000 (est.)
TDP
~1,200W (est.)
Key Feature
CDNA5 architecture, HBM4 memory, Infinity Fabric 4.0
Next-generation CDNA5 architecture. AMD has confirmed MI400 series for late 2026. HBM4 expected.
NVIDIA Rubin (R100)
NVIDIAAnnouncedProcess
TSMC 3nm (est.)
Memory
TBD (HBM4e est.)
FP8 TFLOPS
~10,000+ (est.)
TDP
TBD
Key Feature
Post-Blackwell architecture, NVLink 6.0
NVIDIA confirmed Rubin at GTC 2025. Expected to ship to select partners in late 2026, broad availability 2027.
Intel Falcon Shores
INTELAnnouncedProcess
Intel 18A
Memory
TBD (HBM3e est.)
FP8 TFLOPS
TBD
TDP
TBD
Key Feature
Integrated Xe GPU + compute tiles, Gaudi successor
Intel's next-gen AI accelerator replacing Gaudi 3. Targeting hyperscale and enterprise AI deployments.
2027
3 GPUsGoogle TPU v8
GOOGLERumoredProcess
Custom ASIC
Memory
TBD
FP8 TFLOPS
TBD
TDP
TBD
Key Feature
Liquid cooling, 2× TPU v7 performance target
Expected to maintain Google's ~2-year generation cadence. Likely announced at Google Next 2027.
NVIDIA Rubin Ultra (RU100)
NVIDIARumoredProcess
TSMC 3nm
Memory
TBD (HBM4e)
FP8 TFLOPS
~14,000 (est.)
TDP
TBD
Key Feature
Rubin Ultra refresh — follows Blackwell → Blackwell Ultra pattern
Based on NVIDIA's Ultra refresh cadence (H100→H200, B200→B300). Expected 2–3 quarters after base Rubin.
AMD Instinct MI450X
AMDRumoredProcess
TSMC 2nm (est.)
Memory
TBD (HBM4e est.)
FP8 TFLOPS
TBD
TDP
TBD
Key Feature
CDNA6 architecture target
AMD's roadmap targets annual GPU architecture updates. MI450X expected to compete with Rubin Ultra.
Disclaimer
Specs for "Announced" and "Rumored" GPUs are estimates based on official announcements, roadmap slides, and reputable industry sources. Actual specs, pricing, and availability dates may differ significantly. GPUAdvisor updates this page as new information becomes available.
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